8 March 2016 Scanner baseliner monitoring and control in high volume manufacturing
Author Affiliations +
We analyze performance of different customized models on baseliner overlay data and demonstrate the reduction in overlay residuals by ~10%. Smart Sampling sets were assessed and compared with the full wafer measurements. We found that performance of the grid can still be maintained by going to one-third of total sampling points, while reducing metrology time by 60%. We also demonstrate the feasibility of achieving time to time matching using scanner fleet manager and thus identify the tool drifts even when the tool monitoring controls are within spec limits. We also explore the scanner feedback constant variation with illumination sources.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Pavan Samudrala, Pavan Samudrala, Woong Jae Chung, Woong Jae Chung, Nyan Aung, Nyan Aung, Lokesh Subramany, Lokesh Subramany, Haiyong Gao, Haiyong Gao, Juan-Manuel Gomez, Juan-Manuel Gomez, "Scanner baseliner monitoring and control in high volume manufacturing", Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 977838 (8 March 2016); doi: 10.1117/12.2218162; https://doi.org/10.1117/12.2218162

Back to Top