8 March 2016 Excursion detection using leveling data
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Abstract
Wafer leveling data are usually used inside the exposure tool for ensuring good focus, then discarded. This paper describes the implementation of a monitoring and analysis solution to download these data automatically, together with the correction profiles applied by the scanner. The resulting height maps and focus residuals form the basis for monitoring metrics tailored to catching tool and process drifts and excursions in a high-volume manufacturing (HVM) environment.

In this paper, we present four six cases to highlight the potential of the method: wafer edge monitoring, chuck drift monitoring, correlations between focus residuals and overlay errors, and pre-process monitoring by chuck fingerprint removal.
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MinGyu Kim, MinGyu Kim, Jaewuk Ju, Jaewuk Ju, Boris Habets, Boris Habets, Georg Erley, Georg Erley, Enrico Bellmann, Enrico Bellmann, Seop Kim, Seop Kim, } "Excursion detection using leveling data", Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97783O (8 March 2016); doi: 10.1117/12.2230389; https://doi.org/10.1117/12.2230389
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