9 March 2016 Proposed approach to drive wafer topography for advanced lithography
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One requirement for advanced lithography remains suitable incoming wafer topography. We propose that local wafer flatness be visualized and quantified using the techniques developed for wafer front-surface nanotopography. This is a significant change in that existing wafer topography metrology tools do not enable our proposed approach.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John F. Valley, Andrey Melnikov, John A. Pitney, "Proposed approach to drive wafer topography for advanced lithography", Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97783X (9 March 2016); doi: 10.1117/12.2214627; https://doi.org/10.1117/12.2214627

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