9 March 2016 Proposed approach to drive wafer topography for advanced lithography
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Abstract
One requirement for advanced lithography remains suitable incoming wafer topography. We propose that local wafer flatness be visualized and quantified using the techniques developed for wafer front-surface nanotopography. This is a significant change in that existing wafer topography metrology tools do not enable our proposed approach.
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John F. Valley, Andrey Melnikov, John A. Pitney, "Proposed approach to drive wafer topography for advanced lithography", Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97783X (9 March 2016); doi: 10.1117/12.2214627; https://doi.org/10.1117/12.2214627
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