Translator Disclaimer
25 March 2016 CD bias control on hole pattern
Author Affiliations +
Gridded design rules[1] is major process in configuring logic circuit used 193-immersion lithography. In the scaling of grid patterning, we can make 10nm order line and space pattern by using multiple patterning techniques such as self-aligned multiple patterning (SAMP) and litho-etch- litho-etch (LELE)[2][3][5] . On the other hand, Line cut process has some error parameters such as pattern defect, placement error, roughness and X-Y CD bias with the decreasing scale. Especially roughness and X-Y CD bias are paid attention because it cause cut error and pattern defect. In this case, we applied some smoothing process to care hole roughness[4]. Each smoothing process showed different effect on X-Y CD bias. In this paper, we will report the pattern controllability comparison of trench and block + inverse. It include X-Y CD bias, roughness and process usability. Furthermore we will discuss optimum method focused on X-Y CD bias when we use additional process such as smoothing and shrink etching .
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kyohei Koike, Arisa Hara, Sakurako Natori, Shohei Yamauchi, Masatoshi Yamato, Kenichi Oyama, and Hidetami Yaegashi "CD bias control on hole pattern", Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 97790V (25 March 2016);

Back to Top