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25 March 2016 Directed self-assembly materials for high resolution beyond PS-b-PMMA
Eri Hirahara, Margareta Paunescu, Orest Polishchuk, EunJeong Jeong, Edward Ng, Jianhui Shan, Jian Yin, Jihoon Kim, Yi Cao, Jin Li, SungEun Hong, Durairaj Baskaran, Guanyang Lin
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Proceedings Volume 9779, Advances in Patterning Materials and Processes XXXIII; 977914 (2016) https://doi.org/10.1117/12.2220424
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States
Abstract
To extend directed self-assembly (DSA) of poly(styrene-b-methyl methacrylate) (PS-b-PMMA) for higher resolution, placement accuracy and potentially improved pattern line edge roughness (LER), we have developed a next-generation material platform of organic high-χ block copolymers (“HC series”, AZEMBLYTM EXP PME-3000 series). The new material platform has a built-in orientation control mechanism which enables block copolymer domains to vertically selforient without topcoat/additive or delicate solvent vapor annealing. Furthermore, sub-10 nm lines and spaces (L/S) patterning by two major chemoepitaxy DSA, LiNe and SMARTTM processes, was successfully implemented on 12” wafer substrates by using the PME-3000 lamellar series. The results revealed that the new material platform is compatible with the existing PS-b-PMMA-based chemical prepatterns and standard protocols. We also introduced the built-in orientation control strategy to the conventional PS-b-PMMA system, producing a new generation of PS-b-PMMA materials with facile orientation control. The modified PS-b-PMMA (m-PS-b-PMMA) performed LiNe flow DSA yielding a comparable CD process window with improved LER/LWR/SWR after the L/S patterns were transferred into a Si substrate.
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Eri Hirahara, Margareta Paunescu, Orest Polishchuk, EunJeong Jeong, Edward Ng, Jianhui Shan, Jian Yin, Jihoon Kim, Yi Cao, Jin Li, SungEun Hong, Durairaj Baskaran, and Guanyang Lin "Directed self-assembly materials for high resolution beyond PS-b-PMMA", Proc. SPIE 9779, Advances in Patterning Materials and Processes XXXIII, 977914 (25 March 2016); https://doi.org/10.1117/12.2220424
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KEYWORDS
Directed self assembly
Semiconducting wafers
Scanning electron microscopy
Etching
Silicon
Optical lithography
Polymers
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