A novel full chip process window OPC based on matrix retargeting

Xima Zhang; Zhitang Yu; Qingwei Liu; Xuan Shen; Liguo Zhang; Le Hong; Vlad Liubich; George Lippincott; Cynthia Zhu; James Word

doi:10.1117/12.2219913

15 March 2016 A novel full chip process window OPC based on matrix retargeting

Xima Zhang, Zhitang Yu, Qingwei Liu, Xuan Shen, Liguo Zhang, Le Hong, Vlad Liubich, George Lippincott, Cynthia Zhu, James Word

Author Affiliations +

Proceedings Volume 9780, Optical Microlithography XXIX; 97801C (2016) https://doi.org/10.1117/12.2219913
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States

Abstract

Process window OPC (PWOPC) is widely used in advanced technology nodes as one of the most important resolution enhancement techniques (RET).¹ PWOPC needs to consider not only edge placement error (EPE) from nominal condition simulations, but also constraints based on process variation simulations, such as pinch and bridge related requirements based on process variation band (PVBAND). Those constraints can be challenging to meet as feature size continues to shrink in advanced nodes.

In this paper a novel matrix retargeting based PWOPC was developed to find optimal OPC solutions by solving constraints-based matrix and applying minimal retargeting as needed.² Experiment results showed enhanced process window and reasonable performance.

Citation Download Citation

Xima Zhang, Zhitang Yu, Qingwei Liu, Xuan Shen, Liguo Zhang, Le Hong, Vlad Liubich, George Lippincott, Cynthia Zhu, and James Word "A novel full chip process window OPC based on matrix retargeting", Proc. SPIE 9780, Optical Microlithography XXIX, 97801C (15 March 2016); https://doi.org/10.1117/12.2219913

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