15 March 2016 A novel full chip process window OPC based on matrix retargeting
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Proceedings Volume 9780, Optical Microlithography XXIX; 97801C (2016); doi: 10.1117/12.2219913
Event: SPIE Advanced Lithography, 2016, San Jose, California, United States
Abstract
Process window OPC (PWOPC) is widely used in advanced technology nodes as one of the most important resolution enhancement techniques (RET).1 PWOPC needs to consider not only edge placement error (EPE) from nominal condition simulations, but also constraints based on process variation simulations, such as pinch and bridge related requirements based on process variation band (PVBAND). Those constraints can be challenging to meet as feature size continues to shrink in advanced nodes.

In this paper a novel matrix retargeting based PWOPC was developed to find optimal OPC solutions by solving constraints-based matrix and applying minimal retargeting as needed.2 Experiment results showed enhanced process window and reasonable performance.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xima Zhang, Zhitang Yu, Qingwei Liu, Xuan Shen, Liguo Zhang, Le Hong, Vlad Liubich, George Lippincott, Cynthia Zhu, James Word, "A novel full chip process window OPC based on matrix retargeting", Proc. SPIE 9780, Optical Microlithography XXIX, 97801C (15 March 2016); doi: 10.1117/12.2219913; http://dx.doi.org/10.1117/12.2219913
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KEYWORDS
Optical proximity correction

Semiconducting wafers

Resolution enhancement technologies

Model-based design

Data modeling

Computer programming

Optical lithography

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