15 March 2016 Line edge roughness frequency analysis for SAQP process
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Abstract
The line edge roughness (LER) and line width roughness (LWR) transfer in a self-aligned quadruple patterning (SAQP) process is shown for the first time. Three LER characterization methods, including conventional standard deviation method, power spectral density (PSD) method and frequency domain 3-sigma method, are used in the analysis. The wiggling is also quantitatively characterized for each SAQP step with a wiggling factor. This work will benefit both process optimization and process monitoring.
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Lei Sun, Xiaoxiao Zhang, Shimon Levi, Adam Ge, Hua Zhou, Wenhui Wang, Navaneetha Krishnan, Yulu Chen, Erik Verduijn, Ryoung-han Kim, "Line edge roughness frequency analysis for SAQP process", Proc. SPIE 9780, Optical Microlithography XXIX, 97801S (15 March 2016); doi: 10.1117/12.2229176; https://doi.org/10.1117/12.2229176
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