15 March 2016 Line edge roughness frequency analysis for SAQP process
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Abstract
The line edge roughness (LER) and line width roughness (LWR) transfer in a self-aligned quadruple patterning (SAQP) process is shown for the first time. Three LER characterization methods, including conventional standard deviation method, power spectral density (PSD) method and frequency domain 3-sigma method, are used in the analysis. The wiggling is also quantitatively characterized for each SAQP step with a wiggling factor. This work will benefit both process optimization and process monitoring.
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Lei Sun, Lei Sun, Xiaoxiao Zhang, Xiaoxiao Zhang, Shimon Levi, Shimon Levi, Adam Ge, Adam Ge, Hua Zhou, Hua Zhou, Wenhui Wang, Wenhui Wang, Navaneetha Krishnan, Navaneetha Krishnan, Yulu Chen, Yulu Chen, Erik Verduijn, Erik Verduijn, Ryoung-han Kim, Ryoung-han Kim, } "Line edge roughness frequency analysis for SAQP process", Proc. SPIE 9780, Optical Microlithography XXIX, 97801S (15 March 2016); doi: 10.1117/12.2229176; https://doi.org/10.1117/12.2229176
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