For debugging silicon failures, DFT diagnostics can identify which nets or cells caused the yield loss. But normally, a long time period is needed with many resources to identify which failures are due to one common layout pattern or structure. This paper will present a new yield diagnostic flow, based on preliminary EFA results, to show how pattern analysis can more efficiently detect pattern related systematic defects. Increased visibility on design pattern related failures also allows more precise yield loss estimation.
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Evan Zhao, Jessie Wang, Mason Sun, Jeff Wang, Yifan Zhang, Jason Sweis, Ya-Chieh Lai, Hua Ding, "Using pattern analysis methods to do fast detection of manufacturing pattern failures," Proc. SPIE 9781, Design-Process-Technology Co-optimization for Manufacturability X, 97810Z (16 March 2016);