16 March 2016 Rapid recipe formulation for plasma etching of new materials
Author Affiliations +
Abstract
A fast and inexpensive scheme for etch rate prediction using flexible continuum models and Bayesian statistics is demonstrated. Bulk etch rates of MgO are predicted using a steady-state model with volume-averaged plasma parameters and classical Langmuir surface kinetics. Plasma particle and surface kinetics are modeled within a global plasma framework using single component Metropolis Hastings methods and limited data. The accuracy of these predictions is evaluated with synthetic and experimental etch rate data for magnesium oxide in an ICP-RIE system. This approach is compared and superior to factorial models generated from JMP, a software package frequently employed for recipe creation and optimization.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Meghali Chopra, Meghali Chopra, Zizhuo Zhang, Zizhuo Zhang, John Ekerdt, John Ekerdt, Roger T. Bonnecaze, Roger T. Bonnecaze, "Rapid recipe formulation for plasma etching of new materials", Proc. SPIE 9781, Design-Process-Technology Co-optimization for Manufacturability X, 978111 (16 March 2016); doi: 10.1117/12.2219171; https://doi.org/10.1117/12.2219171
PROCEEDINGS
6 PAGES


SHARE
RELATED CONTENT

A model based, Bayesian approach to the CF4 Ar...
Proceedings of SPIE (March 19 2018)
Wafer charging in different types of plasma etchers
Proceedings of SPIE (January 31 1992)
Plasma and flow modeling of photomask etch chambers
Proceedings of SPIE (December 16 2003)
A study on the Cl2 C2H4 Ar plasma etching of...
Proceedings of SPIE (December 02 2009)

Back to Top