This paper will demonstrate methods to expand the usable design space on dipole-like processes such as unidirectional gate and SADP processes by utilizing the follow-up cut mask to improve the process window. Traditional mask enhancement means for improving the process window in this design realm will be compared to this new cut-mask approach. The unique advantages and disadvantages of the cut-mask solution will be discussed in contrast to those customary methods.
ACCESS THE FULL ARTICLE
Jerome Wandell, Mohamed Salama, William Wilkinson, Mark Curtice, Jui-Hsuan Feng, Shao Wen Gao, Abhishek Asthana, "Expanding the printable design space for lithography processes utilizing a cut mask," Proc. SPIE 9781, Design-Process-Technology Co-optimization for Manufacturability X, 978112 (23 March 2016);