12 October 2016 Development of three-dimensional memory (3D-M)
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Proceedings Volume 9818, 2016 International Workshop on Information Data Storage and Tenth International Symposium on Optical Storage; 981805 (2016) https://doi.org/10.1117/12.2245145
Event: 2016 International Workshop on Information Data Storage and Tenth International Symposium on Optical Storage, 2016, Changzhou, China
Abstract
Since the invention of 3-D ROM in 1996, three-dimensional memory (3D-M) has been under development for nearly two decades. In this presentation, we'll review the 3D-M history and compare different 3D-Ms (including 3D-OTP from Matrix Semiconductor, 3D-NAND from Samsung and 3D-XPoint from Intel/Micron).
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Hong-Yu Yu, Hong-Yu Yu, Chen Shen, Chen Shen, Lingli Jiang, Lingli Jiang, Bin Dong, Bin Dong, Guobiao Zhang, Guobiao Zhang, } "Development of three-dimensional memory (3D-M)", Proc. SPIE 9818, 2016 International Workshop on Information Data Storage and Tenth International Symposium on Optical Storage, 981805 (12 October 2016); doi: 10.1117/12.2245145; https://doi.org/10.1117/12.2245145
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