Extreme temperature packaging: challenges and opportunities

R. Wayne Johnson

doi:10.1117/12.2223741

17 May 2016 Extreme temperature packaging: challenges and opportunities

R. Wayne Johnson

Proceedings Volume 9836, Micro- and Nanotechnology Sensors, Systems, and Applications VIII; 98360L (2016) https://doi.org/10.1117/12.2223741
Event: SPIE Defense + Security, 2016, Baltimore, MD, United States

Abstract

Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

Citation Download Citation

R. Wayne Johnson "Extreme temperature packaging: challenges and opportunities", Proc. SPIE 9836, Micro- and Nanotechnology Sensors, Systems, and Applications VIII, 98360L (17 May 2016); https://doi.org/10.1117/12.2223741

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