Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 9861, including the Title Page, Copyright information, Table of Contents, and Conference Committee listing.
Zalameda and Bison: Thermosense: Thermal Infrared Applications XXXVIII

Sponsored by SPIE

Co-sponsored by FLIR Systems, Inc.

IRCameras LLC

Published by SPIE

Volume 9861

The papers in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. Additional papers and presentation recordings may be available online in the SPIE Digital Library at SPIEDigitalLibrary.org.

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Author(s), "Title of Paper,” in Thermosense: Thermal Infrared Applications XXXVIII, edited by Joseph N. Zalameda, Paolo Bison, Proceedings of SPIE Vol. 9861 (SPIE, Bellingham, WA, 2016) Six-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510601024

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Authors

Numbers in the index correspond to the last two digits of the six-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first four digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Abi-Ramia, Marco Antônio, 12

Arion, Bogdan, 11

Avdelidis, N. P., 0K

Bardhan, Shawli, 16

Beaudoin, Georges, 18, 1C

Bhattacharjee, Debotosh, 15, 16

Bhowmik, Mrinal Kanti, 15, 16

Bison, P., 0J, 0V

Boldrini, S., 0J

Bortolin, A., 0V, 0W

Bouvier, Christian, 11

Burke, Eric R., 02, 0G

Cadelano, G., 0V, 0W

Celorrio, Ricardo, 0E

Chamberland, Martin, 18, 1C

Chulkov, A. O., 0M

Cifuentes, Ángel, 0E

Cramer, K. Elliott, 09, 0N

Criner, Amanda, 0O

Dagel, Daryl J., 03

Das, Kakali, 15, 16

De Carli, M., 0V

de Vries, Jaap, 0U

Dehoff, R. R., 07

Derusova, D. A., 0F

Dinwiddie, R. B., 07

Domack, Christopher S., 02

dos Santos, Laerte, 12

Druzhinin, N. V., 0F

Exarchos, D., 0K

Fabrizio, M., 0J

Farley, Vincent, 10

Fernandes, Henrique C., 0H, 1A

Ferrarini, G., 0V, 0W

Ferrario, A., 0J

Fortin, Vincent, 10

Gagnon, Marc-André, 10

Genest, Marc, 1A

Ghosh, Anjan Kumar, 15

Gogoi, Usha Rani, 15

Gregory, Elizabeth D., 0R

Grossetete, Grant D., 03

Guyot, Éric, 10

Hafley, Robert A., 02

Hassler, Ulf, 1A

Heigel, Jarred, 06

Holland, Steve D., 0R

Horne, Michael R., 0G

Howell, Patricia A., 0N

Hsieh, Sheng-Jen (Tony), 0B, 0S

Huff, Roy, 0T

Huot, François, 18, 1C

Ibarra-Castanedo, Clemente, 0H, 0K, 18, 1C

Iwama, Tatsuya, 1B

Joncas, Simon, 1A

Juarez, Peter D., 09

Kato, Yukitaka, 0L

Kauppinen, T., 0X

Kinzel, Edward C., 0Z

Kirka, M. M., 07

Korey, Scott P., 03

Lagueux, Philippe, 10

Lalonde, Erik, 18, 1C

Lane, Brandon, 04, 06

Lemos, Alisson Maria, 12

Lloyd, P. D., 07

López, Fernando, 0H

Lowe, L. E., 07

MacCallum, Danny O., 03

Madaras, Eric I., 0G

Majumdar, Gautam, 15

Maldague, Xavier P. V., 0H, 0K, 18, 1A, 1C

Marcotte, Frédérick, 10

Marlow, G. S., 07

Matikas, T. E., 0K

McIntosh, Gregory B., 0T

Mendioroz, Arantza, 0E

Metcalf, Jeremy P., 19

Miozzo, A., 0J

Montagner, F., 0J

Morikawa, Junko, 0L

Morioka, Karen, 0H

Moylan, Shawn, 04, 06

Nath, Satyabrata, 16

Ni, Yang, 11

Noguier, Vincent, 11

Ohkubo, Syuichi, 13

Olsen, Richard C., 19

Oswald-Tranta, B., 0P

Paloniitty, S., 0X

Pawar, S. S., 0M

Pribe, Joshua D., 0Z

Robitaille, François, 1A

Roohi, Rakhshan, 0A

Sakagami, Takahide, 1B

Salazar, Agustín, 0E

Schehl, Norman, 0O

Seebo, Jeffrey P., 09

Sfarra, S., 0K

Sheng, Yunlong, 1A

Shiozawa, Daiki, 1B

Siikanen, S., 0X

Sojasi, Saeed, 18, 1C

Tabinowski, Robert, 0U

Tamaki, Yoshitaka, 1B

Taminger, Brian L., 02

Taminger, Karen M., 02

Tamura, Tetsuo, 13

Tan, Zuojun, 0B

Tarpani, José R., 0H

Thandu, Srinivas C., 0Z

Trofimov, Vladislav V., 17

Trofimov, Vyacheslav A., 17

Vallée, Réal, 10

Vavilov, V. P., 0F, 0I, 0M

Vazquez, P., 0K

Wang, Hongjin, 0B, 0S

Webb, John A., 0A

Whitenton, Eric, 04, 06

Winfree, William P., 0N

Xie, Jing, 0B

Yin, Zhaozheng, 0Z

Yousefi, Bardia, 18, 1C

Yu, Lingyao, 1A

Zalameda, Joseph N., 02, 0G, 0N

Zamengo, Massimiliano, 0L

Zatón, Lander, 0E

Zhang, Hai, 0H, 1A

Zhang, Jian, 0B

Zhou, Xunfei, 0S

Conference Committee

Symposium Chair

  • Ming C. Wu, University of California, Berkeley (United States)

Symposium Co-chair

  • Majid Rabbani, Eastman Kodak Company (United States)

Conference Chair

  • Joseph N. Zalameda, NASA Langley Research Center (United States)

Conference Co-chair

  • Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

Conference Program Committee

  • Andrea Acosta, Colbert Infrared Services (United States)

    Nicolas Avdelidis, National Technical University of Athens (Greece)

    Jeff R. Brown, Embry-Riddle Aeronautical University (United States)

    Douglas Burleigh, La Jolla Cove Consulting (United States)

    Fred P. Colbert, Colbert Infrared Services (United States)

    K. Elliott Cramer, NASA Langley Research Center (United States)

    Jaap de Vries, FM Global (United States)

    Ralph B. Dinwiddie, Oak Ridge National Laboratory (United States)

    Sheng-Jen (Tony) Hsieh, Texas A&M University (United States)

    Herbert Kaplan, Honeyhill Technical Company (United States)

    Timo T. Kauppinen, VTT Technical Research Center of Finland (Finland)

    Dennis H. LeMieux, Siemens Power Generation, Inc. (United States)

    Monica Lopez Saenz, IRCAM GmbH (Germany)

    Gregory B. McIntosh, Teasdale Consultants Ltd. (Canada)

    Xavier P. V. Maldague, University Laval (Canada)

    Junko Morikawa, Tokyo Institute of Technology (Japan)

    Gary L. Orlove, FLIR Systems, Inc. (United States)

    Beata Oswald-Tranta, Montan Universität Leoben (Austria)

    G. Raymond Peacock, Temperatures.com, Inc. (United States)

    Piotr Pregowski, Pregowski Infrared Services (Poland)

    Ralph A. Rotolante, Vicon Enterprises Inc. (United States)

    Andres E. Rozlosnik, SI Termografía Infrarroja (Argentina)

    Morteza Safai, The Boeing Company (United States)

    Takahide Sakagami, Kobe University (Japan)

    Steven M. Shepard, Thermal Wave Imaging, Inc. (United States)

    Sami Siikanen, VTT Technical Research Center of Finland (Finland)

    Gregory R. Stockton, Stockton Infrared Thermographic Services, Inc. (United States)

    Vladimir P. Vavilov, Tomsk Polytechnic University (Russian Federation)

Session Chairs

  • 1 Vendor Presentations and Reception: Infrared Applications

    Andres E. Rozlosnik, SI Termografía Infrarroja (Argentina)

    Sheng-Jen (Tony) Hsieh, Texas A&M University (United States)

  • 2 Additive Manufacturing and Processing Industries

    Ralph B. Dinwiddie, Oak Ridge National Laboratory (United States)

    Gregory B. McIntosh, Teasdale Consultants Ltd. (Canada)

  • 3 Robotic Scanning and Remote Sensing

    Beata Oswald-Tranta, Montan Universität Leoben (Austria)

    Junko Morikawa, Tokyo Institute of Technology (Japan)

  • 4 Vibro-Thermography and Nondestructive Testing

    Vladimir P. Vavilov, Tomsk Polytechnic University (Russian Federation)

    Andres E. Rozlosnik, SI Termografía Infrarroja (Argentina)

  • 5 Nondestructive Testing and Composites

    Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

    Nicolas P. Avdelidis, National Technical University of Athens (Greece)

  • 6 Thermal Modeling and Signal Processing

    Steven M. Shepard, Thermal Wave Imaging, Inc. (United States)

    Jaap de Vries, FM Global (United States)

  • 7 Building Materials and Infrastructure Applications

    Xavier Maldague, University Laval (Canada)

    Gregory R. Stockton, Stockton Infrared Thermographic Services, Inc. (United States)

  • 8 Detectors and Imaging Systems

    Sheng-Jen (Tony) Hsieh, Texas A&M University (United States)

  • 9 Biological and Medical Applications

    Ralph A. Rotolante, Vicon Enterprises Inc. (United States)

  • 10 Remote and Multi-Discipline Imaging

    Takahide Sakagami, Kobe University (Japan)

    Jaap de Vries, FM Global (United States)

Introduction

The SPIE Thermosense conference continues to be the oldest and one of the leading international technical conferences focused on scientific, industrial and general uses of infrared imaging, infrared temperature measurements, and image analysis. This annual conference met in Baltimore, Maryland, 17–21 April 2016, and had 51 abstracts submitted, 44 scientific papers presented, and an additional 16 presentations in the vendor session. The presentations comprised 15 different countries (Australia, Austria, Brazil, Canada, China, Finland, France, Greece, India, Italy, Japan, the Russian Federation, Spain, Taiwan and the United States).

In these proceedings, you will find an unequaled depth and breadth of technical information and reference data from worldwide leaders in the application, research, and industrial experts in the field of thermal imaging. The session topics included additive manufacturing, robotic scanning and remote sensing, vibro-thermography, nondestructive testing and composites, thermal modeling and signal processing, building materials and infrastructure applications, detectors and imaging systems, biological and medical applications and remote and multi-discipline imaging. I would like to thank the conference sponsors FLIR Systems, Inc. and IRCameras LLC, for the Best Paper Award and Best Student Paper Award, respectively.

I am especially excited to see new research presented in the areas of additive manufacturing and robotic scanning for composites fabrication. Additive manufacturing and robotic scanning for composites fabrication are a growing field with many potential applications, however the field has its challenges of repeatability, closed loop control, and real time defect inspection. Thermography offers a natural solution since these processes require heat during the build process. It will be exciting to see the solutions develop as they are undoubtedly presented at future Thermosense conferences.

I would also like to mention the 40th Anniversary, which will come up in a couple more years. This meeting will return back to Orlando, Florida in 2018. This city has been the traditional location of Thermosense for roughly 30 years. It is hoped that many past conference attendees and committee members will attend and help to celebrate 40 years of existence.

I would like to mention Andres Rozloznik for his work in leading the vendor session, his overall help in the conference, and his recognition by SPIE for many years of membership and involvement. I would also like to thank the previous chair Sheng-Jen (Tony) Hsieh for his past efforts in Thermosense 2015 and Paolo Bison as conference co-chair for 2016.

Additionally, I would like to thank the committee for entrusting me with chairing the 2016 conference. The support over the past 2 years from the committee and colleagues has made it a rewarding experience. I also want to thank my wife Anita for her support during my travels. As the conference goes forward I want to encourage future conference chairs and committee members to embrace the challenge, take personal ownership, and enjoy the experience of forwarding the rich tradition of Thermosense, setting the example for many successful years to come.

Joseph N. Zalameda

© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 9861", Proc. SPIE 9861, Thermosense: Thermal Infrared Applications XXXVIII, 986101 (22 June 2016); doi: 10.1117/12.2244355; https://doi.org/10.1117/12.2244355
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