13 May 2016 Photonic hybrid assembly through flexible waveguides
Author Affiliations +
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I/O in InP PICs, even with waveguide spot size conversion. In a European research initiative – PHASTFlex - we develop and investigate an innovative, novel assembly concept, in which the waveguides in a matching TriPleX interposer PIC are released during fabrication to make them movable. After assembly of both chips by flip-chip bonding on a common carrier, TriPleX based actuators and clamping functions position and fix the flexible waveguides with the required accuracy.
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K. Wörhoff, K. Wörhoff, A. Prak, A. Prak, F. Postma, F. Postma, A. Leinse, A. Leinse, K. Wu, K. Wu, T. J. Peters, T. J. Peters, M. Tichem, M. Tichem, B. Amaning-Appiah, B. Amaning-Appiah, V. Renukappa, V. Renukappa, G. Vollrath, G. Vollrath, J. Balcells-Ventura, J. Balcells-Ventura, P. Uhlig, P. Uhlig, M. Seyfried, M. Seyfried, D. Rose, D. Rose, R. Santos, R. Santos, X. J. M. Leijtens, X. J. M. Leijtens, B. Flintham, B. Flintham, M. Wale, M. Wale, D. Robbins, D. Robbins, } "Photonic hybrid assembly through flexible waveguides", Proc. SPIE 9891, Silicon Photonics and Photonic Integrated Circuits V, 98911P (13 May 2016); doi: 10.1117/12.2227814; https://doi.org/10.1117/12.2227814

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