An automatic flatness detection system for micro rings is developed. It is made up of machine vision module, ring supporting module and control system. An industry CCD camera with the resolution of 1628×1236 pixel, a telecentric with magnification of two, and light sources are used to collect the vision information. A rotary stage with a polished silicon wafer is used to support the ring. The silicon wafer provides a mirror image and doubles the gap caused by unevenness of the ring. The control system comprise an industry computer and software written in LabVIEW Get Kernel and Convolute Function are selected to reduce noise and distortion, Laplacian Operator is used to sharp the image, and IMAQ Threshold function is used to separate the target object from the background. Based on this software, system repeating precision is 2.19 μm, less than one pixel. The designed detection system can easily identify the ring warpage larger than 5 μm, and if the warpage is less than 25 μm, it can be used in ring assembly and satisfied the final positionary and perpendicularity error requirement of the component.