Translator Disclaimer
22 July 2016 Process optimization of laser-based solderjet bumping for the mounting of optical components
Author Affiliations +
Advanced optical systems of telescopes and scientific instrumentation require high accuracy mounting and joining of components. Applications for deep UV, under high energetic radiation, for vacuum operation, or assemblies subjected to environmental loads (e.g. humidity and temperature) require a replacement of organic adhesives or optical cement by a more robust bonding agent. Soldering allows the bonding of different materials with an inorganic filler material. We present the optimization of the laser-based Solderjet Bumping for the mounting of optical components and the parameters of the bonding process for fused silica and LAK9G15 (radiation resistant glass) with thermally matched metal mounts. The investigation covers the experimental determination and optimization of solder wetting to the respective base materials and the bond strengths achieved.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas Burkhardt, Marcel Hornaff, Andreas Kamm, Diana Burkhardt, Erik Beckert, Ramona Eberhardt, and Andreas Tünnermann "Process optimization of laser-based solderjet bumping for the mounting of optical components", Proc. SPIE 9912, Advances in Optical and Mechanical Technologies for Telescopes and Instrumentation II, 99123X (22 July 2016);

Back to Top