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3 November 2016 Minimum energy of silver and copper nanoparticles for laser sintering (Conference Presentation)
Changmin Lee, Jae W. Hahn
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Proceedings Volume 9927, Nanoengineering: Fabrication, Properties, Optics, and Devices XIII; 99270S (2016) https://doi.org/10.1117/12.2236804
Event: SPIE Nanoscience + Engineering, 2016, San Diego, California, United States
Abstract
The electronics fabrication without using conventional deposition and photolithography has attracted an intense interest in the modern technology. The direct metal pattering based on the laser local sintering of nano ink is one of the alternative manufacturing methods. In this sintering process, some researchers have shown the mechanism of the heating particle. In this paper, we discuss the theoretical analysis of sintering process about silver and copper nanoparticles. For analyzing the sintering process, we use Shi’s model to calculating the melting temperature and surface melting temperature with variation of the particle size. The absorption cross section with respect to wavelength of laser and particle size is calculated by Mie theory. From the results, we suggest the minimum energy per unit area of laser with respect to particle size and wavelength of the laser for the sintering process. These results suggest that the longer the wavelength of the laser, the higher minimum energy for sintering process in copper case. In the silver case, the wavelength of the laser has to be close to 350 nm which is near to the surface plasmon resonance frequency of the silver for minimum energy per unit area.
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Changmin Lee and Jae W. Hahn "Minimum energy of silver and copper nanoparticles for laser sintering (Conference Presentation)", Proc. SPIE 9927, Nanoengineering: Fabrication, Properties, Optics, and Devices XIII, 99270S (3 November 2016); https://doi.org/10.1117/12.2236804
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KEYWORDS
Laser sintering
Silver
Copper
Particles
Nanoparticles
Analytical research
Electronics
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