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28 September 2016 The thickness of DLC thin film affects the thermal conduction of HPLED lights
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Thermal dissipation had an important influence in the quantum effect and life of light emitting diodes (LED) because it enabled heat transfer away from electric devices to the aluminum plate for heat removal. In the industrial processing, the quality of the thermal dissipation was decided by the gumming technique between the PCB and aluminum plate. In this study, we made the ceramic thin films of diamond like carbon (DLC) by vacuum sputtering between the substrate and high power light emitting diodes (HPLED) light to check the influence of heat transfer by DLC thin films. The ceramic dielectric coatings were characterized by several subsequent analyses, especially the measurement of real work temperature of HPLEDs. The X-Ray photoelectron spectroscopy (XPS) patterns revealed that ceramic phases were successfully grown onto the substrate. At the same time, the real work temperatures showed the thickness of DLC thin film coating effectively affected the thermal conduction of HPLEDs.
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Ming Seng Hsu, Jen Wei Huang, and Feng Lin Shyu "The thickness of DLC thin film affects the thermal conduction of HPLED lights", Proc. SPIE 9947, Current Developments in Lens Design and Optical Engineering XVII, 99470W (28 September 2016);


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