10 May 2016 Ultrahigh efficiency EUV contact-hole printing with chromeless phase shift mask
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Contact-hole layer patterning is expected to be one of the first applications for EUV lithography. Conventional darkfield absorber masks, however, are extremely inefficient for these layers, placing even more burden on the already challenging source power demands. To address this concern, a checkerboard phase shift mask configuration has been proposed yielding theoretical throughput gains of 5x assuming a thin-mask modeling. In this manuscript we describe the fabrication of such a mask and demonstrate its imaging performance using the SHARP EUV microscope and MET exposure tool at Lawrence Berkeley National Laboratory. For 25-nm dense features, the phase shift mask was shown to provide a throughput gain of 8x based on SHARP and 7x based on the Berkeley MET. The higher then predicted gain is expected to be due to the fact that the thin mask modeling used in the initial prediction misses shadowing effects.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Patrick Naulleau, Patrick Naulleau, Christopher N. Anderson, Christopher N. Anderson, Weilun Chao, Weilun Chao, Kenneth A. Goldberg, Kenneth A. Goldberg, Eric Gullikson, Eric Gullikson, Farhad Salmassi, Farhad Salmassi, Antoine Wojdyla, Antoine Wojdyla, } "Ultrahigh efficiency EUV contact-hole printing with chromeless phase shift mask", Proc. SPIE 9984, Photomask Japan 2016: XXIII Symposium on Photomask and Next-Generation Lithography Mask Technology, 99840P (10 May 2016); doi: 10.1117/12.2243321; https://doi.org/10.1117/12.2243321


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