4 October 2016 Megasonic cleaning strategy for sub-10nm photomasks
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Abstract
One of the main challenges in photomask cleaning is balancing particle removal efficiency (PRE) with pattern damage control. To overcome this challenge, a high frequency megasonic cleaning strategy is implemented. Apart from megasonic frequency and power, photomask surface conditioning also influences cleaning performance. With improved wettability, cleanliness is enhanced while pattern damage risk is simultaneously reduced. Therefore, a particle removal process based on higher megasonic frequencies, combined with proper surface pre-treatment, provides improved cleanliness without the unintended side effects of pattern damage, thus supporting the extension of megasonic cleaning technology into 10nm half pitch (hp) device node and beyond.
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Jyh-Wei Hsu, Jyh-Wei Hsu, Martin Samayoa, Martin Samayoa, Peter Dress, Peter Dress, Uwe Dietze, Uwe Dietze, Ai-Jay Ma, Ai-Jay Ma, Chia-Shih Lin, Chia-Shih Lin, Rick Lai, Rick Lai, Peter Chang, Peter Chang, Laurent Tuo, Laurent Tuo, } "Megasonic cleaning strategy for sub-10nm photomasks", Proc. SPIE 9985, Photomask Technology 2016, 998515 (4 October 2016); doi: 10.1117/12.2241143; https://doi.org/10.1117/12.2241143
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