Identification of a new source of reticle contamination

Brian J. Grenon; David Brinkley

doi:10.1117/12.2247576

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4 October 2016 Identification of a new source of reticle contamination

Brian J. Grenon, David Brinkley

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Proceedings Volume 9985, Photomask Technology 2016; 998516 (2016) https://doi.org/10.1117/12.2247576
Event: SPIE Photomask Technology, 2016, San Jose, California, United States

Abstract

Since the introduction of 248 and 193 nm lithography sub-pellicle contamination has been a significant problem and a major contributor to reticle costs and semiconductor yield losses. The most common contaminant identified has been ammonium sulfate commonly called haze, however there have been many other contaminants identified and grouped in the category as haze. In attempts to mitigate the cause of this problem various processes and manufacturing protocols have been put in place to either prevent the problem or identify the source of the problem before there is a negative impact in the wafer fab. In spite of efforts to manage the effects of sub-pellicle contamination in the wafer fab, the problem continues to exist. Over the years we have identified many of the compounds and their sources that exist on the sub-pellicle surface, however one has been elusive. This paper will provide both the identification of this compound and its source.

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Brian J. Grenon and David Brinkley "Identification of a new source of reticle contamination", Proc. SPIE 9985, Photomask Technology 2016, 998516 (4 October 2016); https://doi.org/10.1117/12.2247576

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