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4 October 2016Identification of a new source of reticle contamination
Since the introduction of 248 and 193 nm lithography sub-pellicle contamination has been a significant problem and a
major contributor to reticle costs and semiconductor yield losses. The most common contaminant identified has been
ammonium sulfate commonly called haze, however there have been many other contaminants identified and grouped in
the category as haze. In attempts to mitigate the cause of this problem various processes and manufacturing protocols
have been put in place to either prevent the problem or identify the source of the problem before there is a negative
impact in the wafer fab. In spite of efforts to manage the effects of sub-pellicle contamination in the wafer fab, the
problem continues to exist. Over the years we have identified many of the compounds and their sources that exist on the
sub-pellicle surface, however one has been elusive. This paper will provide both the identification of this compound and
its source.
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Brian J. Grenon, David Brinkley, "Identification of a new source of reticle contamination," Proc. SPIE 9985, Photomask Technology 2016, 998516 (4 October 2016); https://doi.org/10.1117/12.2247576