4 October 2016 Nanoimprint wafer and mask tool progress and status for high volume semiconductor manufacturing
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Imprint lithography has been shown to be an effective technique for replication of nano-scale features. Jet and Flash* Imprint Lithography (J-FIL*) involves the field-by-field deposition and exposure of a low viscosity resist deposited by jetting technology onto the substrate. The patterned mask is lowered into the fluid which then quickly flows into the relief patterns in the mask by capillary action. Following this filling step, the resist is crosslinked under UV radiation, and then the mask is removed, leaving a patterned resist on the substrate. There are many criteria that determine whether a particular technology is ready for wafer manufacturing. Defectivity and mask life play a significant role relative to meeting the cost of ownership (CoO) requirements in the production of semiconductor devices. Hard particles on a wafer or mask create the possibility of inducing a permanent defect on the mask that can impact device yield and mask life. By using material methods to reduce particle shedding and by introducing an air curtain system, the lifetime of both the master mask and the replica mask can be extended. In this work, we report results that demonstrate a path towards achieving mask lifetimes of better than 1000 wafers. On the mask side, a new replication tool, the FPA-1100 NR2 is introduced. Mask replication is required for nanoimprint lithography (NIL), and criteria that are crucial to the success of a replication platform include both particle control, resolution and image placement accuracy. In this paper we discuss the progress made in both feature resolution and in meeting the image placement specification for replica masks.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoichi Matsuoka, Yoichi Matsuoka, Junichi Seki, Junichi Seki, Takahiro Nakayama, Takahiro Nakayama, Kazuki Nakagawa, Kazuki Nakagawa, Hisanobu Azuma, Hisanobu Azuma, Kiyohito Yamamoto, Kiyohito Yamamoto, Chiaki Sato, Chiaki Sato, Fumio Sakai, Fumio Sakai, Yukio Takabayashi, Yukio Takabayashi, Ali Aghili, Ali Aghili, Makoto Mizuno, Makoto Mizuno, Jin Choi, Jin Choi, Chris E. Jones, Chris E. Jones, } "Nanoimprint wafer and mask tool progress and status for high volume semiconductor manufacturing", Proc. SPIE 9985, Photomask Technology 2016, 99851G (4 October 2016); doi: 10.1117/12.2243114; https://doi.org/10.1117/12.2243114

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