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5 March 2022 Thin-film flip-chip UVB LEDs realized by electrochemical etching
Michael A. Bergmann, Johannes Enslin, Martin Guttmann, Luca Sulmoni, Neysha Lobo-Ploch, Tim Kolbe, Tim Wernicke, Michael Kneissl, Åsa Haglund
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Proceedings Volume PC12001, Gallium Nitride Materials and Devices XVII; PC120010T (2022) https://doi.org/10.1117/12.2609581
Event: SPIE OPTO, 2022, San Francisco, California, United States
Abstract
We will give an overview of different concepts to increase the light extraction efficiency (LEE) of ultraviolet (UV) light-emitting diodes (LEDs) with a focus on thin-film flip-chip (TFFC) devices. Optical simulations show that a TFFC design can greatly improve the LEE with a transparent p-side, reflective contacts, and optimized surface roughening. We will demonstrate UVB-emitting TFFC LEDs based on our fabrication platform for AlGaN thin films with high aluminum content. The fabrication is compatible with a standard LED process and uses substrate removal based on selective electrochemical etching as the key enabling technology.
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Michael A. Bergmann, Johannes Enslin, Martin Guttmann, Luca Sulmoni, Neysha Lobo-Ploch, Tim Kolbe, Tim Wernicke, Michael Kneissl, and Åsa Haglund "Thin-film flip-chip UVB LEDs realized by electrochemical etching", Proc. SPIE PC12001, Gallium Nitride Materials and Devices XVII, PC120010T (5 March 2022); https://doi.org/10.1117/12.2609581
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KEYWORDS
Electrochemical etching
Light emitting diodes
Thin films
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