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17 March 2023 Planar- and roll-based transfer printing for scalable heterogeneous integration
Martin D. Dawson, Michael J. Strain, Benoit Guilhabert, Dimitars Jevtics, Alexander A. Lagatsky
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Proceedings Volume PC12425, Smart Photonic and Optoelectronic Integrated Circuits 2023; PC124250N (2023) https://doi.org/10.1117/12.2646170
Event: SPIE OPTO, 2023, San Francisco, California, United States
Abstract
The development of advanced optoelectronic systems requires the intimate integration of multiple, different photonic materials and device structures at micron scales. A number of approaches are being explored to address this pressing challenge. Here we focus on soft-stamp-based transfer printing in both planar and roll based formats, to achieve a widely applicable capability in heterogeneous integration with micron-scale accuracy. We illustrate the capabilities of our custom tools by two examples, the first focusing on planar printing of GaN microlenses onto diamond substrates and waveguide facets and the second focusing on continuous roll-based printing of GaN micro-LED pixels at quarter VGA resolution.
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Martin D. Dawson, Michael J. Strain, Benoit Guilhabert, Dimitars Jevtics, and Alexander A. Lagatsky "Planar- and roll-based transfer printing for scalable heterogeneous integration", Proc. SPIE PC12425, Smart Photonic and Optoelectronic Integrated Circuits 2023, PC124250N (17 March 2023); https://doi.org/10.1117/12.2646170
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KEYWORDS
Printing
Gallium nitride
Microlens
Optical alignment
Photonic integrated circuits
Polishing
Semiconducting wafers
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