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In laser processing, the intensity distribution of the laser beam affects the crater formation and the distribution of ablated particles ejection. In this study, we demonstrated the ejection control of semiconductor microdroplets such as the droplet size and ejection direction by irradiation of the target substrate using a ring-shaped pulsed laser. In addition, we demonstrated the suppression of spatter generation in laser welding of metals with support from the ring-shaped beam.
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