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12 March 2024 Large-wafer heterogeneously integrated InGaAs photodetector sensors
Matthew Dummer, Jonathan Klamkin, Bei Shi, Bowen Song, Simone S. Brunelli, Michael McGivney, Douglas Oakley, Daniel Renner
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Proceedings Volume PC12880, Physics and Simulation of Optoelectronic Devices XXXII; PC128800B (2024) https://doi.org/10.1117/12.3012522
Event: SPIE OPTO, 2024, San Francisco, California, United States
Abstract
Aeluma has developed breakthrough technology to manufacture high-performance compound semiconductor devices, such as photodetectors and lasers, on large-diameter substrates. This path to scaling and cost reduction could enable broad market adoption of these high-performance technologies. Aeluma’s offerings include photodetectors, photodetector arrays, and lasers for silicon photonics. Key to the technology is the ability to deposit compound semiconductor device structures on mismatched substrates including 12-inch Silicon, to subsequently manufacture devices with large-scale microelectronics foundries, and to integrate optical devices with electronics using either wafer-scale packaging or direct monolithic integration.
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Matthew Dummer, Jonathan Klamkin, Bei Shi, Bowen Song, Simone S. Brunelli, Michael McGivney, Douglas Oakley, and Daniel Renner "Large-wafer heterogeneously integrated InGaAs photodetector sensors", Proc. SPIE PC12880, Physics and Simulation of Optoelectronic Devices XXXII, PC128800B (12 March 2024); https://doi.org/10.1117/12.3012522
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KEYWORDS
Photodetectors
Indium gallium arsenide
Sensors
Compound semiconductors
Laser applications
Silicon photonics
Optics manufacturing
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