Scalable and versatile chip to fiber optical interconnects

Guillaume Basset; Roger Krähenbühl; Martina Renggli; Stefan Mohrdiek

doi:10.1117/12.3003107

12 March 2024 Scalable and versatile chip to fiber optical interconnects

Guillaume Basset, Roger Krähenbühl, Martina Renggli, Stefan Mohrdiek

Proceedings Volume PC12892, Optical Interconnects XXIV; PC1289206 (2024) https://doi.org/10.1117/12.3003107
Event: SPIE OPTO, 2024, San Francisco, California, United States

Abstract

Plug and play fiber coupling at the wafer-scale is highly relevant to interconnect photonic integrated circuits (PICs), switches and multiplexer for short to long range communication, as well as chiplets in new chip design with optical interconnects. A new solution is presented being compact, low-loss, and in plane, adaptable to a wide range of fibers. It is based on beam-shaping reflecting elements monolithically fabricated with integrated comp like fiber alignment structures. Successful assembly of a 12-fiber ribbon is demonstrated with excess losses as low as 0.35 dB. The processes and methods are highly homogeneous and scalable.

Conference Presentation

Citation Download Citation

Guillaume Basset, Roger Krähenbühl, Martina Renggli, and Stefan Mohrdiek "Scalable and versatile chip to fiber optical interconnects", Proc. SPIE PC12892, Optical Interconnects XXIV, PC1289206 (12 March 2024); https://doi.org/10.1117/12.3003107

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