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Field Guide to Optical Lithography
Author(s): Chris A. Mack
Published: 2006
https://doi.org/10.1117/3.665802
PDF ISBN: 9780819478214 | Print ISBN: 9780819462077
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TABLE OF CONTENTS
DOWNLOAD THE COMPLETE FIELD GUIDE
EBOOK TOPIC
Front Matter
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EBOOK TOPIC
Definition: Semiconductor Lithography
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Overview of the Lithography Process
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Processing: Substrate Preparation
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Processing: Photoresist Spin Coating
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Processing: Post-Apply Bake
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Processing: Alignment and Exposure
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Processing: Post-Exposure Bake
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Processing: Development
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Processing: Pattern Transfer
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Maxwell's Equations: The Mathematics of Light
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The Plane Wave and the Phasor
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Basic Imaging Theory
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Diffraction
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Fraunhofer Diffraction: Examples
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The Numerical Aperture
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Fourier Optics
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Spatial Coherence and Oblique Illumination
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Partial Coherence
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Aberrations
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Aberrations: The Zernike Polynomial
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Aberrations: Zernike Examples
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Chromatic Aberration
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Horizontal-Vertical (H-V) Bias
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Defocus
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Flare
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Vector Nature of Light
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Polarization
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The Optical Invariant
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Immersion Lithography: Resolution
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Immersion Lithography: Depth of Focus
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Standing Waves: Definition
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Standing Waves: Mathematics
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Fresnel Reflectivity
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Swing Curves
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Top Antireflective Coatings (TARC)
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Bottom Antireflective Coatings (BARC)
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Novolak/DNQ Resists
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Chemically Amplified Resists
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Absorption of Light
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Photoresist Bleaching and the Dill Parameters
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Exposure Kinetics
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Measuring the Dill ABC Parameters
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Chemically Amplified Resist Kinetics
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Diffusion in Chemically Amplified Resists
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Acid Loss Mechanisms
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Post-Apply Bake Effects
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Photoresist Development Kinetics
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Surface Inhibition
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Developer Temperature and Concentration
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The Development Path
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NILS: The Normalized Image Log-Slope
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NILS: The Log-Slope Defocus Curve
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NILS: Image Optimization
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NILS: Exposure Optimization
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NILS: PEB Optimization
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NILS: Development Optimization
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NILS: Total Process Optimization
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Defining Photoresist Linewidth
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Critical Dimension Control
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Critical Dimension Control: Effect on Devices
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Overlay Control
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Line Edge Roughness
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Metrology: Critical Dimension
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Metrology: Overlay