Access to eBooks is limited to institutions that have purchased or currently subscribe to the SPIE eBooks program. eBooks are not available via an individual subscription. SPIE books (print and digital) may be purchased individually on SPIE.Org.

Contact your librarian to recommend SPIE eBooks for your organization.
Chapter 6b:
Grazing Angle Collector Contamination
Abstract
Optical lithography using deep ultraviolet (DUV) light with a wavelength of 193 nm, together with immersion technology, is extendable down to the 45-nm node. However, using this technology to achieve half-pitch resolutions of 32 nm and below for future generations of even denser devices would require double exposure or double-imaging techniques that would halve wafer production throughput while markedly increasing mask set prices. Extreme ultraviolet lithography (EUVL), with a wavelength of 13.5 nm, is today considered the most viable solution to replace optical lithography for high-volume chip manufacturing at the 32-nm node and below.
Online access to SPIE eBooks is limited to subscribing institutions.
CHAPTER 6b
24 PAGES


SHARE
Back to Top