Precise micromachining technologies for high performance microsensors, field emitters, and optical devices have been developed. A number of requirements have to be met for these devices including control in etch rate, profile, selectivity, surface morphology, and etch-induced damage. As the density, sensitivity, and/or speed of these devices increase, high aspect ratio microstructures with narrow width and large depth are needed. Therefore, improvements in dry etching technologies are necessary to meet the multiple requirements of these advanced devices.
Online access to SPIE eBooks is limited to subscribing institutions.