Translator Disclaimer
Abstract
Fiber optics and free-space optoelectronic technologies have been widely investigated as means to alleviate data communication bottlenecks at the machineto- machine, back-plane and board-to-board interconnection level. Recent breakthroughs in the fabrication of spatial arrays of optoelectronic emitters and detectors and their heterogeneous integration with Si-CMOS electronic chips now also encourage the use of photonics as a wire replacement technology at the inter- and intra-multichip-module (MCM) interconnection level. With this approach one aims to increase the communication functions between the latter electronic processing modules, relaxing their bandwidth limitations. These limitations are primarily imposed by fundamental electrical signal propagation issues and the limited number of electrical chip pin-outs.
Online access to SPIE eBooks is limited to subscribing institutions.
CHAPTER 7
26 PAGES


SHARE
Advertisement
Advertisement
Back to Top