Thermal Processes

doi:10.1117/3.924283.ch7

Thermal Processes

Book: Introduction to Semiconductor Manufacturing Technology, Second Edition

Author(s): Hong Xiao

Published: 2012

https://doi.org/10.1117/3.924283.ch7

Author Affiliations +

Abstract

One of the advantages of the silicon substrate over other semiconductor substrates is the high-temperature processing capability of silicon. Silicon wafer processing involves many high-temperature procedures (700 to 1200 °C). This chapter covers these high-temperature thermal processes, including diffusion, oxidation, deposition, and annealing, in both standard furnace and rapid thermal processing.