Objectives

After finishing this chapter, the reader will be able to:

• list the four components of photoresist

• describe the difference between positive and negative photoresists

• describe a photolithography processing sequence

• list four alignment and exposure systems

• identify the most commonly used alignment and exposure system in IC production

• describe the wafer movement in a track-stepper integrated system

• explain the relationship between resolution and depth of focus with wavelength and numerical aperture

• list at least three candidates for next-generation lithography.