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After finishing this chapter, the reader will be able to:

    • list the four components of photoresist
    • describe the difference between positive and negative photoresists
    • describe a photolithography processing sequence
    • list four alignment and exposure systems
    • identify the most commonly used alignment and exposure system in IC production
    • describe the wafer movement in a track-stepper integrated system
    • explain the relationship between resolution and depth of focus with wavelength and numerical aperture
    • list at least three candidates for next-generation lithography.
Online access to SPIE eBooks is limited to subscribing institutions.

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