Access to eBooks is limited to institutions that have purchased or currently subscribe to the SPIE eBooks program. eBooks are not available via an individual subscription. SPIE books (print and digital) may be purchased individually on SPIE.Org.

Contact your librarian to recommend SPIE eBooks for your organization.
Plasma processes are widely used in semiconductor processing. For example, all patterned etching in IC fabrication is either a plasma etch or dry etch process. Plasma-enhanced CVD (PECVD) and high-density plasma CVD (HDP-CVD) processes are widely used for dielectric depositions. Ion implanters use plasma sources to generate ions for wafer doping and to provide electrons to neutralize ions on wafer surfaces. Plasmas are also used in physical vapor deposition (PVD) processes, in which metal is sputtered from a target surface by ion bombardment and deposited on a wafer surface. Remote plasma source systems are commonly used in process chamber cleaning, film stripping, and film deposition processes. This chapter covers the basic properties of plasma and its applications in semiconductor processes, focusing mainly on etch and CVD.
Online access to SPIE eBooks is limited to subscribing institutions.

Back to Top