In the previous two chapters we followed the evolution of the current second-generation HD/third-generation materials technologies and their associated architectures as defined in the open literature thus far. It is now meaningful to assess the relative performance of these technologies, utilizing the dark current, 1/f noise, and MTF models that we have developed, by a consideration of three specific FPA types: the HOT MWIR FPA, the HOT LWIR FPA, and the SWIR FPA. The three relevant parameters that help to differentiate these technologies are MTF, NETD, and operability. For the purposes of this materials technology comparison, the idealized case of a constant bandgap will be assumed as a function of operating temperature.
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