Interconnect Issues

doi:10.1117/3.2265078.ch2

Interconnect Issues

Book: Copper Interconnect Technology

Author(s): Christoph Steinbruchel, Barry L. Chin

Published: 2001

https://doi.org/10.1117/3.2265078.ch2

Author Affiliations +

Abstract

Several factors contribute to the performance of a particular interconnect scheme, including its architecture and the properties of the materials involved. A basic figure of merit to such a scheme is its RC delay, which represents a measure of the time delay for signal propagation. R denotes the resistance of an interconnectmetal line, and C denotes the effective capacitance between the line and its surroundings.