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Chapter 2:
Interconnect Issues
Abstract
Several factors contribute to the performance of a particular interconnect scheme, including its architecture and the properties of the materials involved. A basic figure of merit to such a scheme is its RC delay, which represents a measure of the time delay for signal propagation. R denotes the resistance of an interconnectmetal line, and C denotes the effective capacitance between the line and its surroundings.
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CHAPTER 2
14 PAGES


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