Access to eBooks is limited to institutions that have purchased or currently subscribe to the SPIE eBooks program. eBooks are not available via an individual subscription. SPIE books (print and digital) may be purchased individually on SPIE.Org.

Contact your librarian to recommend SPIE eBooks for your organization.
Chapter 2:
Interconnect Issues
Abstract
Several factors contribute to the performance of a particular interconnect scheme, including its architecture and the properties of the materials involved. A basic figure of merit to such a scheme is its RC delay, which represents a measure of the time delay for signal propagation. R denotes the resistance of an interconnectmetal line, and C denotes the effective capacitance between the line and its surroundings.
Online access to SPIE eBooks is limited to subscribing institutions.
CHAPTER 2
14 PAGES


SHARE
Back to Top