14 January 2019 Studying resist performance for contact holes printing using EUV interference lithography
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Abstract
Extreme ultraviolet interference lithography (EUV-IL) is a relatively simple and inexpensive technique that can pattern high-resolution line/space and has been successfully used for the resist performance testing. While the aerial image in EUV-IL formed by two beams is straightforward to understand and has contrast of 1, the aerial image formed by four beams providing contact holes is rather complicated. The beam polarization and relative phases of the individual beams play a significant role in the aerial image formation in four-beam interference lithography. In particular, controlling the relative phase of the beams is very difficult to achieve due to short wavelength. To circumvent this problem, we propose an effective double exposure four-beam interference lithography method, by intentionally designing the grating with a slightly different pitch to create an optical path difference that is longer than the coherence length of the EUV light (13.5 nm). We numerically prove the effective double exposure four-beam interference is not sensitive to the phases difference and verify our analytical model by printing both positive tone chemically amplified resist and a negative tone inorganic resist.
© 2019 Society of Photo-Optical Instrumentation Engineers (SPIE) 1932-5150/2019/$25.00 © 2019 SPIE
Xiaolong Wang, Li-Ting Tseng, Dimitrios Kazazis, Zuhal Tasdemir, Michaela Vockenhuber, Iacopo Mochi, and Yasin Ekinci "Studying resist performance for contact holes printing using EUV interference lithography," Journal of Micro/Nanolithography, MEMS, and MOEMS 18(1), 013501 (14 January 2019). https://doi.org/10.1117/1.JMM.18.1.013501
Received: 16 October 2018; Accepted: 14 December 2018; Published: 14 January 2019
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Cited by 6 scholarly publications.
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KEYWORDS
Polarization

Extreme ultraviolet

Lithography

Photomasks

Diffraction gratings

Printing

Extreme ultraviolet lithography

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