1 January 2011 Wafer-level vacuum packaging with lateral interconnections and vertical feedthroughs for microelectromechanical system gyroscopes
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Abstract
A wafer-level vacuum packaging based on anodic bonded glass-silicon-glass triple stack with both lateral interconnections and vertical feedthroughs is presented. A z-axis gyroscope is packaged and tested to verify the packaging process. The packaged gyroscope achieved a Q factor of 26000, increased by a factor of 30 when compared to the same gyroscope without vacuum packaging. The pressure in the packaged cavity is ∼100 Pa, and the stability of the Q factor in three months is ∼3%. Experiment results indicate that the proposed wafer-level vacuum packaging is feasible and suitable for high-performance wafer-level packaged gyroscopes.
© (2011) Society of Photo-Optical Instrumentation Engineers (SPIE)
Qian Cheng Zhao, Zhen Chuan Yang, Zhong Yang Guo, Hai Tao Ding, Mo Li, Gui Zhen Yan, "Wafer-level vacuum packaging with lateral interconnections and vertical feedthroughs for microelectromechanical system gyroscopes," Journal of Micro/Nanolithography, MEMS, and MOEMS 10(1), 011507 (1 January 2011). https://doi.org/10.1117/1.3565459 . Submission:
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