1 January 2011 Wafer-level vacuum packaging with lateral interconnections and vertical feedthroughs for microelectromechanical system gyroscopes
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Abstract
A wafer-level vacuum packaging based on anodic bonded glass-silicon-glass triple stack with both lateral interconnections and vertical feedthroughs is presented. A z-axis gyroscope is packaged and tested to verify the packaging process. The packaged gyroscope achieved a Q factor of 26000, increased by a factor of 30 when compared to the same gyroscope without vacuum packaging. The pressure in the packaged cavity is ∼100 Pa, and the stability of the Q factor in three months is ∼3%. Experiment results indicate that the proposed wafer-level vacuum packaging is feasible and suitable for high-performance wafer-level packaged gyroscopes.
© (2011) Society of Photo-Optical Instrumentation Engineers (SPIE)
Qian Cheng Zhao, Qian Cheng Zhao, Zhen Chuan Yang, Zhen Chuan Yang, Zhong Yang Guo, Zhong Yang Guo, Hai Tao Ding, Hai Tao Ding, Mo Li, Mo Li, Gui Zhen Yan, Gui Zhen Yan, } "Wafer-level vacuum packaging with lateral interconnections and vertical feedthroughs for microelectromechanical system gyroscopes," Journal of Micro/Nanolithography, MEMS, and MOEMS 10(1), 011507 (1 January 2011). https://doi.org/10.1117/1.3565459 . Submission:
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