1 June 2012 Mechanical characterization of SU-8 thin films through varying effective aspect ratios for microelectromechanical systems application
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Abstract
This work presents the mechanical characterization of SU-8 photoresists studied in the form of microscaled free-standing thin films with various effective length/width (aspect) ratios, achieved by a tensile testing method. Specimens were designed with gauge segments measuring 240 to 540 μm long and 40 to 80 μm wide with thickness fixed at 20 μm, all fabricated in the same processing conditions. The experiments were carried out on a microtensile testing system which had a load and displacement resolution of 0.25 mN and 10 nm, respectively. With a tensile loading speed of 0.02  μm/s, the average fracture strength of SU-8 photoresist was measured to be 66.34 MPa, and the calculated Young's modulus ranged from 0.86 to 2.33 GPa and the maximum strain from 1.02% to 9.70%, with variation dependent on the effective aspect ratio of the tested films. As a result, effective aspect ratio is concluded to be a significant factor mechanically charactering the size effect of SU-8 photoresist in microscale.
© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE)
Jinkui Chu, Jinkui Chu, Jiali Gao, Jiali Gao, Le Guan, Le Guan, Guoqing Zhang, Guoqing Zhang, Ze Liu, Ze Liu, } "Mechanical characterization of SU-8 thin films through varying effective aspect ratios for microelectromechanical systems application," Journal of Micro/Nanolithography, MEMS, and MOEMS 11(2), 023006 (1 June 2012). https://doi.org/10.1117/1.JMM.11.2.023006 . Submission:
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