12 July 2012 Lithography assisted self-assembly of contact holes on 300-mm wafer scale
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Self-assembly of block copolymers is a potential technique to be used in the fabrication of microelectronic devices. In some cases, the self-assembly is directed by means of an additional technique, e.g. photolithography. This paper studies the impact of ArFi-lithography on the properties of the polymer after the directed assembly. Placement, critical dimension and critical dimension uniformity of the features are analyzed and discussed and compared to an integrated circuit application according to the international technology roadmap for semiconductors roadmap.
© 2012 Society of Photo-Optical Instrumentation Engineers (SPIE)
Sander Wuister, Sander Wuister, Jo Finders, Jo Finders, Emiel Peeters, Emiel Peeters, Chris van Heesch, Chris van Heesch, } "Lithography assisted self-assembly of contact holes on 300-mm wafer scale," Journal of Micro/Nanolithography, MEMS, and MOEMS 11(3), 031304 (12 July 2012). https://doi.org/10.1117/1.JMM.11.3.031304 . Submission:

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