Three-dimensional geometrical modeling of plasma transfer effects on line edge roughness: comparison with experiments and rules of thumb

Vassilios Constantoudis; George Kokkoris; Evangelos Gogolides

doi:10.1117/1.JMM.12.4.041310

12 November 2013 Three-dimensional geometrical modeling of plasma transfer effects on line edge roughness: comparison with experiments and rules of thumb

Vassilios Constantoudis, George Kokkoris, Evangelos Gogolides

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 12, Issue 4, 041310 (November 2013). https://doi.org/10.1117/1.JMM.12.4.041310

Abstract

The transfer of the line edge roughness (LER) from the resist to the substrate sidewall by means of an anisotropic plasma-etching process depends on both the physicochemical reactions of plasma species with the resist and substrate and the morphology of the resist sidewalls. We show that a geometrical model based on the reliable representation of the resist sidewall roughness can capture the main experimental trends and behaviors. Predictions of the model regarding the role of resist sidewall anisotropy and the effects of resist LER on substrate slope are also presented. Finally, rules of thumb defining the slope and the necessary conditions to have LER reduction in substrate sidewalls are derived and discussed.

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Vassilios Constantoudis, George Kokkoris, and Evangelos Gogolides "Three-dimensional geometrical modeling of plasma transfer effects on line edge roughness: comparison with experiments and rules of thumb," Journal of Micro/Nanolithography, MEMS, and MOEMS 12(4), 041310 (12 November 2013). https://doi.org/10.1117/1.JMM.12.4.041310

Published: 12 November 2013

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