28 February 2013 Development of extreme ultraviolet mask pattern inspection technology using projection electron beam optics
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Abstract
Extreme ultraviolet (EUV) lithography with a 13.5 nm exposure wavelength is a leading candidate for the next-generation lithography because of its excellent resolution for 16 nm half pitch (hp) node devices and beyond. High sensitivity EUV mask pattern defect detection is one of the major issues to realize device fabrication with EUV lithography. First, to estimate targeted pattern defect detection size, a simulation for defect printability was carried out. In order to achieve the required inspection sensitivity applicable for 1X nm node, a projection electron microscopy (PEM) system was employed, which enabled us to do inspection in higher resolution and with higher speed in comparison to those of the conventional deep ultraviolet and electron beam inspection systems. By incorporating high electron energy and low optical aberration into the PEM, we designed a system for 16 nm hp node defect inspection. To guarantee the quality of the 16 nm node EUV mask, corresponding sized programmed defect masks were designed, and a PEM system defect detection was evaluated by using the current system for 2X nm generation.
© 2013 Society of Photo-Optical Instrumentation Engineers (SPIE)
Ryoichi Hirano, Ryoichi Hirano, Hidehiro Watanabe, Hidehiro Watanabe, Susumu Lida, Susumu Lida, Tsuyoshi Amano, Tsuyoshi Amano, Tsuneo Terasawa, Tsuneo Terasawa, Masahiro Hatakeyama, Masahiro Hatakeyama, Takeshi Murakami, Takeshi Murakami, } "Development of extreme ultraviolet mask pattern inspection technology using projection electron beam optics," Journal of Micro/Nanolithography, MEMS, and MOEMS 12(2), 021003 (28 February 2013). https://doi.org/10.1117/1.JMM.12.2.021003 . Submission:
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