25 September 2013 Fabricating process of hollow out-of-plane Ni microneedle arrays and properties of the integrated microfluidic device
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Abstract
Although microfluidic devices that integrate microfluidic chips with hollow out-of-plane microneedle arrays have many advantages in transdermal drug delivery applications, difficulties exist in their fabrication due to the special three-dimensional structures of hollow out-of-plane microneedles. A new, cost-effective process for the fabrication of a hollow out-of-plane Ni microneedle array is presented. The integration of PDMS microchips with the Ni hollow microneedle array and the properties of microfluidic devices are also presented. The integrated microfluidic devices provide a new approach for transdermal drug delivery.
© 2013 Society of Photo-Optical Instrumentation Engineers (SPIE)
Jun Zhu, Ying Cao, Hong Wang, Yigui Li, Xiang Chen, Di Chen, "Fabricating process of hollow out-of-plane Ni microneedle arrays and properties of the integrated microfluidic device," Journal of Micro/Nanolithography, MEMS, and MOEMS 12(3), 033019 (25 September 2013). https://doi.org/10.1117/1.JMM.12.3.033019 . Submission:
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