25 September 2013 Performance of silicon-on-insulator multiuser MEMS processes–based electrothermally actuated silicon microgrippers
Author Affiliations +
Recently, microgrippers are finding more importance in the field of tissue engineering and microassembly in semiconductor electronics. Large force and, hence, large displacement, low power, and low temperature are the essential features to be considered during the design of the microgrippers. The electrical and mechanical behaviors of electrothermally actuated silicon microgrippers are presented. The effect of increasing the flexure length and the cold arm area to improve the displacement is discussed. These microgrippers are normally of the open type, in which the arms have an initial open gap of 20 μm, and they move away from each other with the applied voltage. The displacement of each arm is observed to be 24 μm for the applied voltage of 10 V. The response time of the device is less than 5 ms, and the maximum power dissipation is 110 mW. The displacement of the microgrippers can be increased with increased flexure length and cold arm length with short extended arms. This structure also shows lower stress.
© 2013 Society of Photo-Optical Instrumentation Engineers (SPIE)
Sujatha Lakshminarayanan, Sujatha Lakshminarayanan, Siddhartha Goutham Murali, Siddhartha Goutham Murali, Saravanan Mani, Saravanan Mani, Selvakumar Varatharajan Subramani, Selvakumar Varatharajan Subramani, } "Performance of silicon-on-insulator multiuser MEMS processes–based electrothermally actuated silicon microgrippers," Journal of Micro/Nanolithography, MEMS, and MOEMS 12(3), 033020 (25 September 2013). https://doi.org/10.1117/1.JMM.12.3.033020 . Submission:


Design techniques for surface-micromachining MEMS processes
Proceedings of SPIE (September 18 1995)
Measured forces and displacements of integrated force arrays
Proceedings of SPIE (September 14 1995)
Micro-shutter developments for IR applications
Proceedings of SPIE (August 18 2008)
Chip-level three-dimensional assembling of microsystems
Proceedings of SPIE (March 09 1999)
Integration and packaging of MEMS relays
Proceedings of SPIE (April 09 2000)

Back to Top