The major issue related to line width roughness (LWR) is the significant LWR of the photoresist patterns printed by 193-nm lithography that is partially transferred into the gate stack during the subsequent plasma etching steps. The strategy used today to overcome this issue is to apply postlithography treatments to reduce photoresist pattern LWR before transfer. In this article, we investigate the impact of various plasma treatments (HBr, H 2 , He, Ar) on the minimization of the LWR of dense and isolated photoresist patterns and its transfer during gate patterning. To do so, we use critical dimension scanning electron microscopy measurements combined with power spectrum density fitting method to extract unbiased LWR values and provide a spectral analysis of the LWR. We show that plasma treatments that lead to carbon redeposition from the gas phase on the resist pattern sidewalls are less efficient to reduce LWR than plasma treatments where the redeposition is limited. Among all plasma chemistries, H 2 plasmas seem very promising to decrease resist LWR in the whole spectral range, while maintaining square resist profiles. In addition, we show that all frequency roughness components are not equally transferred during gate patterning, and more particularly that the high frequency roughness components are lost.